![]() After clearing the underfill, e we use rubbing alcohol, and rub with a toothbrush to clean off any residue. (6:35) The underfill combines with the flux to make something that you can just clear off. ![]() We’re using the flat part of the angle iron to push through the underfill. We are using a nice flat soldering iron tip to get that gook and underfill off. The flux will heat up with the soldering iron and combine with the underfill making it easier to clean off. We’re going to use a flat tip soldering iron, flux, and rubbing alcohol.įirst, we’re going to get rid of this underfill. (5:15) With the chip off and positioned under the microscope, we are set up to clean the chip. Step 4) Clean the Memory Chip With a Soldering Iron, Flux, and Alcohol Remove the memory chip from the logic board (back). This is used to orient the memory chip in the fixture. On the underside of the chip, you can see that one corner has a different pattern, an extra pad. (4:58) Once the memory chip is off the board, we let it cool off for a few minutes. Otherwise you might damage the pads from the chip, making it impossible to read. You don’t want to take the memory chip off before the solder balls underneath have melted and the underfill is liquid. We can also use the sharper edge of an X-ACTO knife. I t is resisting not only the solder but also the underfill. You can see the resistance from the memory chip. (4:00) We use these long curved, pointed tweezers to gently lift the memory chip off the board. Note that this process is done in a vented area since the melting flux and underfill can give off a strong smell. We apply the flux around the edges of the memory chip and carefully apply the hot air to promote melting of the underfill. For top hot air, we use a Hakko Hot Air Station. (3:25) Here, we are using top hot air and flux to promote the melting of the solder and improve heat transfer. (This section of the video is difficult to hear because the hot air blowing is very loud.) Step 3) Remove the Memory Chip with Hot Air Use a preheater to preheat the logic board. Underfill is a hardened adhesive – like an epoxy – that manufacturers use under a chip to increase rigidity, transfer heat more efficiently, and dissipate mechanical stress throughout a device’s package. (2:50) The memory chip is soldered to the board, but it also has underfill on it. (2:38) On the back of the logic board, the underside of the board, you can see the memory chip. (2:30) We take off the camera components in preparation for the next step because they don’t do well with the heat. Once those are removed, the logic board is freed. To get to the logic board, there are a few screws and connectors to undo. ![]() (1:58) Once all of the screws are out, we can open up the phone and expose the logic board. (0:24) We open it up and start removing all the screws. For the S4 and S5 Galaxy phones, there’s a little bit more involved in taking them apart, but S3 phones and LG phones are pretty straightforward. (0:19) The Samsung Galaxy S3 comes apart pretty easily. Step 1) Take the Phone Apart and Locate the Memory Chip After that, we will apply specific data recovery software to read and save the data. We will use a specialized fixture to extract all of the data from the memory chip. We will show you how we locate the memory chip, remove it using heat treatment, and clean it. The video begins by taking apart the broken Samsung Galaxy S3 phone.
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